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Unofficial; not affiliated with the European Commission. Source: European Commission, EU Funding & Tenders Portal. Reused under the Commission's reuse policy (Decision 2011/833/EU, CC BY 4.0); we reorganise the facts and add counts.

International collaboration EU and Japan on semiconductors

International collaboration EU and Japan on semiconductors (DIGITAL-JU-CHIPS-2026-SG-JAPAN) is an open funding topic under Digital Europe with a stated budget of €5 million. The next deadline is , 52 days away as of .

In our daily copy of EU Funding & Tenders Portal data (), Digital Europe has 19 open or forthcoming calls here; the median stated budget for Digital Europe calls is €5 million; 5 Digital Europe calls have a deadline in December 2026.

International collaboration EU and Japan on semiconductors. Source: EU Funding & Tenders Portal
IdentifierDIGITAL-JU-CHIPS-2026-SG-JAPAN
ProgrammeDigital Europe
StatusOpen for submission
Opening date
Deadline
SubmissionSingle-stage
Type of actionDigital Europe Joint Undertaking Simple Grants
Budget€5 million (2026 budget)
Expected number of grants2
EU contribution per project€3 million to €5 million
CallDIGITAL-JU-CHIPS-2026-SG-JAPAN — DIGITAL-JU-CHIPS-2026-SG-JAPAN
Themes on this siteDigital and data
Cross-cutting priorities (portal)Digital Agenda

Read the official topic page on the EU Funding & Tenders Portal

Type of action

Check the official page for the type of action, funding rate and what you need to submit.

Deadline

Deadline as published: . Check the official page for the exact time and any changes; late submissions are not accepted.

Next steps

  1. Open the official topic page and read the conditions, the call document and the evaluation criteria.
  2. Create a free EU Login and register your organisation to get a PIC, if you do not have one.
  3. Find partners if the topic needs a consortium (the portal's partner search is free).
  4. Start a draft in the submission system from the topic page and submit before the deadline.

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